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Thermal interface materials: historical perspective, status, and future directions

Publication Type

Journal Article

Authors

Prasher, Ravi S.

DOI

10.1109/JPROC.2006.879796

Abstract

With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very beneficial

Journal

Proc. IEEE

Year of Publication

2006

Organization

Energy Technologies Area, Energy Storage and Distributed Resources Division, Thermal Energy Group

Research Areas

Prasher Lab