Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
Thermal resistances at packaging interfaces are occupying a larger portion of the overall thermal resistance from a semiconductor die to ambient. Substantial improvement of the performance of thermal interface materials (TIMs) is required to achieve effective electronic cooling. This report is a brief review of the current status of TIM research. Particular focus is given to the fundamental understanding of heat conduction phenomena in polymer-based TIM composites at packaging interfaces in thin-film form. Promising nanostructured TIMs for future applications are also discussed.
ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
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