Microelectronic package including thermally conductive sealant between heat spreader and substrate

Microelectronic package including thermally conductive sealant between heat spreader and substrate

TitleMicroelectronic package including thermally conductive sealant between heat spreader and substrate
Publication TypePatent
Year of Publication2008
AuthorsAshish Gupta, Leonel R Arana, David Song, Chia-Pin Chiu, Ravi S Prasher, Chris Matayabas, Nirupama Chakrapani
Application Number20080237843:A1
Date Published10/2008
Abstract

A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.

URLhttps://patents.google.com/patent/US20080237843A1/en