Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers

Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers

TitleCooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers
Publication TypeConference Paper
Year of Publication2008
AuthorsRavi S Prasher, Je-Young Chang
Conference NameASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels
Date Published01/2008
PublisherAmerican Society of Mechanical Engineers
Keywordscooling, Heat exchangers, Microchannels
Abstract

The research community is experiencing a revolution in microscale and nanoscale heat transfer, with a focus on developing fundamental experiments and theoretical techniques. More recently, these advancements have begun to influence the design of electronic systems. A futuristic electronic cooling solution might include high efficiency thermoelectric devices made from nanomaterials for the cooling of hotspots on a chip, nano/micro particle laden thermal interface materials and micro-pin fin/microchannel based heat exchanger. Liquid cooling using integrated microscale heat exchangers is a promising future technology to address issues associated with integrated circuit thermal management. In this paper recent advances made by us on technology development of microchannel/micro-pin-fin heat exchangers is presented. Particular attention is given to the impact of hotspots on the performance of microchannel cooling.

DOI10.1115/ICNMM2008-62384