Publications by Research Area
Publications by Division
Chowdhury, , Ihtesham, Ravi S. Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ravi Mahajan, David Koester, and Rama Venkatasubramanian."Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics."ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability (2009) 521–526. DOI
Chowdhury, Ihtesham, Ravi S. Prasher, Kelly Lofgreen, Gregory M . Chrysler, Sridhar Narasimhan, Ravi Mahajan, David Koester, Randall Alley, and Rama Venkatasubramanian."On-chip cooling by superlattice-based thin-film thermoelectrics."Nat. Nanotechnol. 4 (2009) 235–238. DOI
Kim, , Sarah E, R Scott List, James G Maveety, Alan M. Myers, Quat T Vu, Ravi S. Prasher, Ravi Mahajan, and Gilroy Vandentop."Using external radiators with electroosmotic pumps for cooling integrated circuits." (2006).
Prasher, Ravi S., and Ravi Mahajan."Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink." (2005).
Torresola, Javier, Chia-Pin Chiu, Gregory M . Chrysler, Dean Grannes, Ravi Mahajan, Ravi S. Prasher, and Abhay A. Watwe."Density factor approach to representing impact of die power maps on thermal management."IEEE Trans. Adv. Packag. 28.4 (2005) 659–664. DOI
Prasher, Ravi S., and Ravi Mahajan."Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling." (2005).
Sauciuc, Ioan, Ravi S. Prasher, Je-Young Chang, Ravi Mahajan, and C. Migliaccio."Bearing life: A future package cooling challenge." 14 (2005).
Sauciuc, Ioan, Ravi S. Prasher, Je-Young Chang, Hakan Erturk, Gregory M . Chrysler, Chia-Pin Chiu, and Ravi Mahajan."Thermal Performance and Key Challenges for Future CPU Cooling Technologies."ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference (2005) 353–364. DOI
Mahajan, Ravi, Chia-Pin Chiu, and Ravi S. Prasher."Thermal interface materials: a brief review of design characteristics and materials."Electronics Cooling (2004).