System and method of heat extraction from an integrated circuit die

System and method of heat extraction from an integrated circuit die

TitleSystem and method of heat extraction from an integrated circuit die
Publication TypePatent
Year of Publication2002
AuthorsRavi S Prasher
Application Number6351387
Date Published02/2002
Abstract

A heat dissipation system and method for extracting heat from an integrated circuit die includes attaching an integrated circuit die to a heat extraction substrate capable of extracting heat from the integrated circuit die. Further, a heat transport medium is attached to the heat extraction substrate, to transport the extracted heat from the heat extraction substrate to ambient. In some embodiments, the heat dissipation device can further include a heat sink, attached to the heat transport medium, to further facilitate the transporting of the heat from the heat transport medium to ambient.