An acoustic and dimensional mismatch model for thermal boundary conductance between a vertical mesoscopic nanowire/nanotube and a bulk substrate

An acoustic and dimensional mismatch model for thermal boundary conductance between a vertical mesoscopic nanowire/nanotube and a bulk substrate

TitleAn acoustic and dimensional mismatch model for thermal boundary conductance between a vertical mesoscopic nanowire/nanotube and a bulk substrate
Publication TypeJournal Article
Year of Publication2007
AuthorsRavi S Prasher, Tao Tong, Arun Majumdar
JournalJ. Appl. Phys.
Volume102
Pagination104312
Date Published11/2007
Abstract

A theoretical model to calculate the thermal boundary conductance (Kapitza conductance) or, alternatively, thermal boundary resistance (Kapitza resistance) between a vertically grown mesoscopic nanowire/nanotube and a bulk substrate is presented. The thermal boundary resistance at the interface between the mesoscopic geometry and a three-dimensional substrate is primarily due to two reasons: (1) dimensional mismatch in the phonon density of states and (2) mismatch in the acoustic properties. Our model based on the solution of the elastic wave equation in the substrate and the mesoscopic geometry incorporates both these effects.

DOI10.1063/1.2816260